SMT and DIP are both ways of integrating parts on the PCB board. The main difference is that SMT does not require drilling on the PCB, while DIP requires the PIN PIN of the part to be inserted into the already drilled hole.
Surface Mounted Technology (SMT) is a process of mounting small parts onto a PCB board using a mounting machine. The production process consists of PCB board positioning, solder paste printing, component mounting, back welding furnace and inspection. With the advancement of technology, SMT can also be used to mount larger parts, such as mounting a host board onto a larger mechanical component.
The successful integration of SMT is highly dependent on the positioning and size of parts. In addition, the quality of solder paste and printing also play critical roles.
DIP refers to “plug-in”, which is the process of adding parts to a PCB board. When the size of the part is too large for SMT technology, the plug-in form is used to integrate parts. There are two ways to achieve this in the industry – artificial plug-in and robot plug-in. The main production process is: applying glue (to prevent tin plating on improper places), plug-in, inspection, over wave welding, brushing the board (to remove the stains left in the process of furnace) and making inspection.
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